| PART |
Description |
Maker |
| 0690081119 |
Die Set for 690081114, Modular Plug, FFC 68, 6/6 Circuit, Short Body
|
Molex Electronics Ltd.
|
| 9-0744506-3 C-1-528041-5 |
DIE SET SHIELD CRIMP)HVP800 90DEG. 25 SQMM
|
TE Connectivity Ltd
|
| DF13-TB2630HC_US-DS DF13-TB2630HCUS-DS DF13-TB2630 |
PACKAGING: SIX DIE SET ASSEMBLIES TO BE PACKAGED INTO ZIP-LOCK PLASTIC BAG
|
Hirose Electric
|
| 0-0519024-2 5-0744010-1 1-0519151-3 1-0519151-1 3- |
ERGOCRIMP-DIE SET ERGOCRIMP MATRIZE
|
Tyco Electronics
|
| 1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
| AX101321 |
Modular Connectors - CAT6 Modular Jack - KeyConnect
|
List of Unclassifed Man...
|
| AX101310 |
Modular Connectors - CAT5E Modular Jack - KeyConnect
|
List of Unclassifed Man...
|
| AX101316 |
Modular Connectors - CAT5E Modular Jack - KeyConnect
|
List of Unclassifed Man...
|
| IRF7805PBF IRF7805PBF-15 |
N Channel Application Specific MOSFETs
HEXFET㈢ Chip-Set for DC-DC Converters
HEXFET? Chip-Set for DC-DC Converters
|
International Rectifier
|
| ST16-19RFRDCS 7759 ST16 ST19-RFRDCS ST16-RFRDCS |
ST16-19RFRDCS CHIP SET INTERFACE SPECIFICATION
CHIP SET INTERFACE SPECIFICATION
From old datasheet system
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/ |
DDR SDRAM 256Mb E-die (x4, x8) 256Mb的DDR SDRAM的电子芯片（了x4，x8
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-PDIP -40 to 125
256Mb E-die DDR SDRAM Specification 66 TSOP-II
Dual Micropower Precision Low-Voltage Operational Amplifier 8-SOIC -55 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PLCC
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PDIP
DDR SDRAM 256Mb E-die (x4, x8)
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
